Cooling device

ABSTRACT

A cooling device is configured to cool a heat source. The cooling device includes a tank, a cover and a cooling liquid. The tank includes a bottom surface, a tank inlet and a tank outlet. The cover is disposed on the tank. The cover and the tank form a space therebetween, and the space is configured to accommodate the heat source. The cooling liquid is located in the space.

CROSS-REFERENCE TO RELATED APPLICATIONS

This non-provisional application claims priority under 35 U.S.C. § 119(a) on Patent Application No(s). 201811263995.5 filed in China, P.R.C. on Oct. 26, 2018, the entire contents of which are hereby incorporated by reference.

TECHNICAL FIELD

The present disclosure relates to a cooling device, more particularly to a cooling device including a tank inlet and a tank outlet.

BACKGROUND

A common immersion cooling device includes a tank, which is divided to a liquid portion and a vapor portion. The liquid portion is located below the vapor portion and configured to accommodate a cooling liquid which is volatile and low boiling, and there is a heat dissipation device in the vapor portion. A server can be immersed into the cooling liquid for the cooling liquid to absorb heat generated by the server. A portion of the cooling liquid would evaporate into vapor by the heat. When the vapor flows to the vapor portion, the heat in the vapor can be removed by the heat dissipation device, the then the vapor is condensed into the cooling liquid and drops back to the liquid portion of the tank due to gravity.

SUMMARY

According to one aspect of the present disclosure, a cooling device is configured to cool a heat source. The cooling device includes a tank, a cover and a cooling liquid. The tank includes a bottom surface, a tank inlet and a tank outlet. The cover is disposed on the tank. The cover and the tank form a space therebetween, and the space is configured to accommodate the heat source. The cooling liquid is located in the space.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only and thus are not intending to limit the present disclosure and wherein:

FIG. 1 is an exploded cross-sectional view of a cooling device and a heat source according to one embodiment of the present disclosure;

FIG. 2 is a cross-sectional view of the cooling device when the heat source is disposed in the cooling device;

FIG. 3 is a cross-sectional view of the cooling device during the operation of the heat source in FIG. 1;

FIG. 4 is a cross-sectional view of a cooling device according to another embodiment of the present disclosure during the operation of the heat source;

FIG. 5 is a cross-sectional view of a cooling device according to yet another embodiment of the present disclosure during the operation of the heat source;

FIG. 6 is a cross-sectional view of a cooling device according to still another embodiment of the present disclosure during the operation of the heat source;

FIG. 7 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source;

FIG. 8 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source;

FIG. 9 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source;

FIG. 10 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source; and

FIG. 11 is a cross-sectional view of the cooling device and the heat source in FIG. 10 when the operation is completed.

DETAILED DESCRIPTION

In the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the disclosed embodiments. It will be apparent, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are schematically shown in order to simplify the drawing.

Please refer to FIG. 1 to FIG. 2, FIG. 1 is an exploded cross-sectional view of a cooling device and a heat source according to one embodiment of the present disclosure, and FIG. 2 is a cross-sectional view of the cooling device when the heat source is disposed in the cooling device.

This embodiment provides a cooling device 10 a (e.g., an immersion cooling device) configured to cool a heat source 20 (e.g., a server). The cooling device 10 a includes a tank 100 a, a cover 200 a and a cooling liquid 300 a. The tank 100 a includes a bottom surface 110 a, a tank inlet 120 a and a tank outlet 130 a. As shown in the figure, the tank 100 a may be placed on a platform P (e.g., a table) in a way that the bottom surface 110 a of the tank 100 a faces the platform P. The cover 200 a is disposed on the tank 100 a. In this embodiment and some embodiments of the present disclosure, the cover 200 a and the bottom surface 110 a are respectively located at two opposite sides of the tank 100 a, but the disclosure is not limited thereto. In some other embodiments, the cover and the bottom surface may be located adjacent to each other. In this embodiment, the cover 200 a and the tank 100 a form a space S therebetween. The space S is configured to accommodate the heat source 20. The cooling liquid 300 a is located in the space S. In this embodiment and some embodiments of the present disclosure, a liquid level 310 a of the cooling liquid 300 a is located farther away from the bottom surface 110 a of the tank 100 a than the heat source 20, and the heat source 20 is completely immersed in the cooling liquid 300 a, but the disclosure is not limited thereto. In some other embodiments, as long as heat generated by the heat source is able to be transferred to the cooling liquid, the heat source may be partially immersed in the cooling liquid. In this embodiment and some embodiments of the present disclosure, the cooling liquid 300 a is volatile, non-conductive and low boiling liquid, such as refrigerant, but the disclosure is not limited thereto. In some other embodiments, the cooling liquid may be pure water or liquid fluoride. In this embodiment, when a signal of a wire of the heat source 20 contacting the cooling liquid 300 a is 1 kHz, a permittivity of the cooling liquid 300 a is close to 1. In this embodiment and some embodiments of the present disclosure, the permittivity of the cooling liquid 300 a is approximately 1.8. In this embodiment, when the heat source 20 and the cooling liquid 300 a are both accommodated in the space S, heat generated by the heat source 20 is absorbed by the cooling liquid 300 a so as to cause the cooling liquid 300 a to evaporate into vapor form (e.g., vapor 320 a shown in FIG. 2), and the vapor 320 a may be discharged out of the space S via the tank outlet 130 a, thereby dissipating the heat. Therefore, there would not be too much vapor 320 a remaining in the space S, such that less of the vapor 320 a would escape from the opening for receiving the cover 200 a when the cover is removed.

In this embodiment and some embodiments of the present disclosure, the cooling device 10 a further includes a liquid channel 400 a and a vapor channel 500 a, the liquid channel 400 a is connected to the tank inlet 120 a, and the vapor channel 500 a is connected to the tank outlet 130 a. The cooling liquid 300 a may be poured into the liquid channel 400 a to flow into the space S and to replenish the evaporated cooling liquid 300 a. The vapor 320 a may flow into the vapor channel 500 a via the tank outlet 130 a. The vapor 320 a has a lower density than that of the cooling liquid 300 a, a volume flow rate of the vapor 320 a is higher than that of the cooling liquid 300 a; therefore, to reach a balance of mass flow rate between the tank inlet 120 a and the tank outlet 130 a, an inner diameter of the vapor channel 500 a may be larger than an inner diameter of the liquid channel 400 a, but the disclosure is not limited thereto. In some other embodiments, the balance may also be reached by increasing the quantity of the vapor channel.

Please refer to FIG. 3, which is a cross-sectional view of the cooling device during the operation of the heat source in FIG. 1. During the operation of the heat source 20, a part of the cooling liquid 300 a was evaporated into vapor form (i.e., vapor 320 a), and then the liquid level 310 a of the cooling liquid 300 a is fallen to a liquid level 310 a′. The vapor 320 a leaves the space S from the tank outlet 130 a, and the cooling liquid 300 a flows into the space S via the tank inlet 120 to replenish the evaporated cooling liquid 300 a. Generally, liquid tends to flow down and gas tends to go up, thus, in this embodiment and some embodiments of the present disclosure, the tank inlet 120 a of the tank 100 a is located closer to the bottom surface 110 a of the tank 100 a than the tank outlet 130 a, but the disclosure is not limited thereto. In some other embodiments, the tank inlet and the tank outlet may be located at the same level.

In this embodiment and some embodiments of the present disclosure, the vapor channel 500 a includes an inlet end 510 a and an outlet end 520 a. The inlet end 510 a is connected to the tank outlet 130 a of the tank 100 a, and a distance Dla between the inlet end 510 a and the bottom surface 110 a is substantially equal to a distance D2 a between the outlet end 520 a and the bottom surface 110 a. In other words, the inlet end 510 a and the outlet end 520 a are substantially located at the same level, but the disclosure is not limited thereto. Please refer to FIG. 4, which is a cross-sectional view of a cooling device according to another embodiment of the present disclosure during the operation of the heat source. This embodiment provides a cooling device 10 b, which is similar to the aforementioned cooling device 10 a, thus a detailed description of the similar features between these embodiments may not be repeated. In this embodiment and some embodiments of the present disclosure, a distance Dlb of an inlet end 510 b and a bottom surface 110 b of the cooling device 10 b is smaller than a distance D2 b of an outlet end 520 b and the bottom surface 110 b of the cooling device 10 b. In other words, a vapor channel 500 b is disposed to a tank 100 b in an inclined manner. Accordingly, a liquid level 310 b of a cooling liquid 300 b is allowed to be closer to a cover 200 b and the cooling liquid 300 b is allowed flows into the inlet end 510 b and occupy a portion of the vapor channel 500 b, ensuring only the vapor form of the cooling liquid 300 b (i.e., vapor 320 b) to pass through the outlet end 520 b of the vapor channel 500 b.

In the previous embodiment, the cover 200 a is placed horizontally, but the disclosure is not limited thereto. Please refer to FIG. 5, which is a cross-sectional view of a cooling device according to yet another embodiment of the present disclosure during the operation of the heat source. This embodiment provides a cooling device 10 c, which is similar to the aforementioned cooling device 10 a, thus a detailed description of the similar features between these embodiments may not be repeated. In this embodiment and some embodiments of the present disclosure, a cover 200 c of the cooling device 10 c includes a first side 210 c and a second side 220 c, a distance D3 between the first side 210 c and a bottom surface 110 c is larger than a distance D4 between the second side 220 c and the bottom surface 110 c. In other words, the first side 210 c is located farther away from the bottom surface 110 c of the tank 100 c than the second side 220 c. In addition, the first side 210 c is closer to a tank outlet 130 c of a tank 100 c than the second side 220 c, such that the vapor form of the cooling liquid 300 c (i.e., vapor 320 c) tends to flow toward the first side 210 c. Consequently, the vapor 320 c would easily leave the space S via the tank outlet 130 c.

Please refer to FIG. 6, which is a cross-sectional view of a cooling device according to still another embodiment of the present disclosure during the operation of the heat source. This embodiment provides a cooling device 10 d, which is similar to the aforementioned cooling device 10 a, thus a detailed description of the similar features between these embodiments may not be repeated. In this embodiment and some embodiments of the present disclosure, the cooling device 10 d further includes a heat exchange portion 600 d. The heat exchange portion 600 d is, for example, a tube, but the disclosure is not limited thereto. In some other embodiments, the heat exchange portion may be another tank. In this embodiment and some embodiments of the present disclosure, the heat exchange portion 600 d includes a first end 610 d and a second end 620 d. The first end 610 d is connected to a vapor channel 500 d and the second end 620 d is connected to a liquid channel 400 d. The vapor 320 d flows to the first end 610 d of the heat exchange portion 600 d from the vapor channel 500 d. The heat exchange portion 600 d is configured to provide an extra space for the processes of condensation and evaporation of a cooling liquid 300 d to occur (i.e., the transition from the cooling liquid 300 d and vapor 320 d). The vapor 320 d turns into the cooling liquid 300 d in the heat exchange portion 600 d and flows back to the liquid channel 400 d through the second end 620 d due to gravity. In short, the cooling liquid 300 d in the space S is able to be evaporated into the gaseous phase and then is condensed to flow back to the space S, forming a circulation without losing any of it.

Please refer to FIG. 7, which is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source. This embodiment provides a cooling device 10 e, which is similar to the aforementioned cooling device 10 a, thus a detailed description of the similar features between these embodiments may not be repeated. In this embodiment and some embodiments of the present disclosure, the cooling device 10 e further includes a heat dissipation device 700 e. The heat dissipation device 700 e is, for example, a liquid cooling device and is connected to a heat exchange portion 600 e. The heat dissipation device 700 e is able to absorb and then dissipate heat in the vapor 320 e in the heat exchange portion 600 e. Therefore, the heat dissipation device 700 e is able to accelerate the phase transition of the cooling liquid 300 e. In some other embodiments, the heat dissipation device may be a fan that is not in contact with the heat exchange portion; in such a case, the airflow generated by the fan also helps to accelerate the phase transition of the cooling liquid.

Please refer to FIG. 8, which is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source. This embodiment provides a cooling device 10 f, which is similar to the aforementioned cooling device 10 a, thus a detailed description of the similar features between these embodiments may not be repeated. In this embodiment and some embodiments of the present disclosure, the cooling device 10 f further includes an electrical connector 800 f disposed at a cover 200 f. In addition, the electrical connector 800 f is located in a hole (not shown in the figures) of the cover 200 f and is electrically connected to the heat source 20 via a wire 22 located in the tank 100 f. The electrical connector 800 f is configured to transmit electricity or signal to the heat source 20 or receive electricity or signal from the heat source 20. This allows the heat source 20 to exchange electrical power or signal to another external device through the wire 22 and the electrical connector 800 f. In addition, the hole of the cover 200 may be, for example, in a square shape, and the electrical connector 800 f is easier to be sealed to the cover 200 f with respect to the conventional gap between the wire and the tank. As a result, the air-tightness of the tank 100 f is increased with respect to the conventional tank.

Please refer to FIG. 9, which is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source. This embodiment provides a cooling device 10 g, which is similar to the aforementioned cooling device 10 a, thus a detailed description of the similar features between these embodiments may not be repeated. In this embodiment and some embodiments of the present disclosure, the cooling device 10 g further includes a liquid pump device 900 g, and a heat exchange portion 600 g is a tank. The liquid pump device 900 g is connected to and disposed on a liquid channel 400 g and is connected to a tank 100 g and the heat exchange portion 600 g via the liquid channel 400 g. In this embodiment and some embodiments of the present disclosure, a cooling liquid 300 g in the space S can be completely pumped to the heat exchange portion 600 g by the liquid pump device 900 g. By doing so, the vapor form of the cooling liquid 300 g is prevented from escaping from the opening for receiving a cover 200 g when the cover 200 g is removed. Further, there may be a valve (not shown in the figures) disposed in the liquid pump device 900 g for preventing the cooling liquid 300 g from flowing back to the space S. During the operating of the heat source 20, the valve is switched on. However, the valve is optional, and the disclosure is not limited thereto.

Please refer to FIG. 10 and FIG. 11, FIG. 10 is a cross-sectional view of a cooling device according to still yet another embodiment of the present disclosure during the operation of the heat source, and FIG. 11 is a cross-sectional view of the cooling device and the heat source in FIG. 10 when the operation is completed. This embodiment provides a cooling device 10 h, which is similar to the aforementioned cooling device 10 a, thus a detailed description of the similar features between these embodiments may not be repeated. In this embodiment and some embodiments of the present disclosure, the cooling device 10 h further includes an air pump device 1000 h located in a heat exchange portion 600 h which is connected to a tank 100 g via a vapor channel 500 h. In this embodiment and some embodiments of the present disclosure, the space S may be filled with air A with the help of the air pump device 1000 h so as to force a cooling liquid 300 h and a vapor 320 h to move toward the heat exchange portion 600 h. By doing so, most in the space S is the air A and vapor form of the cooling liquid 300 h is prevented from escaping from the opening for receiving a cover 200 h when the cover 200 h is removed. Further, there may be a valve (not shown in the figures) disposed in the air pump device 1000 h for preventing the air A from flowing back to the heat exchange portion 600 h. During the operating of the heat source 20, the valve is switched on. However, the valve is optional, and the disclosure is not limited thereto.

According to the cooling device in the embodiments abovementioned, when the heat source and the cooling liquid are both accommodated in the space, heat generated by the heat source is absorbed by the cooling liquid so as to cause the cooling liquid to evaporate into vapor form, and the vapor may be discharged out of the space via the tank outlet, thereby dissipating the heat. Therefore, there would not be too much vapor remaining in the space, such that less of the vapor would escape from the opening for receiving the cover when the cover is removed.

In some embodiments, the cooling device further includes a liquid channel and a vapor channel, the liquid channel is connected to the tank inlet, and the vapor channel is connected to the tank outlet. To reach a balance of mass flow rate between the tank inlet and the tank outlet, an inner diameter of the vapor channel may be larger than an inner diameter of the liquid channel.

In some embodiments, the tank inlet of the tank is located closer to the bottom surface of the tank than the tank outlet. Generally, liquid tends to flow down and gas tends to go up.

In some embodiments, the vapor channel is disposed to the tank in an inclined manner. Accordingly, the liquid level of the cooling liquid is allowed to be closer to the cover and the cooling liquid is allowed flows into the inlet end and occupy a portion of the vapor channel, ensuring only the vapor form of the cooling liquid to pass through the outlet end of the vapor channel.

In some embodiments, the first side is located farther away from the bottom surface than the second side. In addition, the first side is closer to the tank outlet than the second side, such that the vapor form of the cooling liquid tends to flow toward the first side. Consequently, the vapor would easily leave the space via the tank outlet.

In some embodiments, the cooling device further includes a heat exchange portion. The heat exchange portion is configured to provide an extra space for the processes of condensation and evaporation of the cooling liquid to occur (i.e., the transition from the cooling liquid and vapor). The vapor turns into the cooling liquid in the heat exchange portion and flows back to the liquid channel through the second end due to gravity. In short, the cooling liquid in the space is able to be evaporated into the gaseous phase and then is condensed to flow back to the space, forming a circulation without losing any of it.

In some embodiments, the cooling device further includes a heat dissipation device. The heat dissipation device is able to absorb and then dissipate heat in the vapor in the heat exchange portion. Therefore, the heat dissipation device is able to accelerate the phase transition of the cooling liquid.

In some embodiments, the cooling device further includes an electrical connector disposed at the cover. In addition, the electrical connector is located in a hole of the cover and is electrically connected to the heat source via a wire located in the tank. The electrical connector is configured to transmit electricity or signal to the heat source or receive electricity or signal from the heat source. This allows the heat source to exchange electrical power or signal to another external device through the wire and the electrical connector. In addition, the hole of the cover may be, for example, in a square shape, and the electrical connector is easier to be sealed to the cover with respect to the conventional gap between the wire and the tank. As a result, the air-tightness of the tank is increased with respect to the conventional tank.

In some embodiments, the cooling device further includes a liquid pump device, and the heat exchange portion is a tank. The cooling liquid in the space can be completely pumped to the heat exchange portion by the liquid pump device. By doing so, the vapor form of the cooling liquid is prevented from escaping from the opening for receiving the cover when the cover is removed.

In some embodiments, the cooling device further includes an air pump device. The space may be filled with air with the help of the air pump device so as to force the cooling liquid and the vapor to move toward the heat exchange portion. By doing so, most in the space is the air and vapor form of the cooling liquid is prevented from escaping from the opening for receiving the cover when the cover is removed.

The embodiments are chosen and described in order to best explain the principles of the present disclosure and its practical applications, to thereby enable others skilled in the art best utilize the present disclosure and various embodiments with various modifications as are suited to the particular use being contemplated. It is intended that the scope of the present disclosure is defined by the following claims and their equivalents. 

What is claimed is:
 1. A cooling device, configured to cool a heat source, comprising: a tank, including a bottom surface, a tank inlet and a tank outlet; a cover, disposed on the tank, the cover and the tank forming a space therebetween, and the space configured to accommodate the heat source; and a cooling liquid, located in the space.
 2. The cooling device according to claim 1, wherein the tank inlet of the tank is closer to the bottom surface of the tank than the tank outlet.
 3. The cooling device according to claim 2, further comprising a liquid channel and a vapor channel, the liquid channel connected to the tank via the tank inlet, and the vapor channel connected to the tank via the tank outlet.
 4. The cooling device according to claim 3, wherein the vapor channel includes an inlet end and an outlet end, the inlet end is connected to the tank outlet of the tank, and the inlet end is closer to the bottom surface of the tank than the outlet end.
 5. The cooling device according to claim 4, wherein the cover includes a first side and a second side, the first side is closer to the tank outlet of the tank than the second side, and the first side is farther away from the bottom surface of the tank than the second side.
 6. The cooling device according to claim 3, further comprising a heat exchange portion, wherein the vapor channel is connected to the liquid channel via the heat exchange portion.
 7. The cooling device according to claim 6, further comprising a heat dissipation device connected to the heat exchange portion.
 8. The cooling device according to claim 1, further comprising an electrical connector connected to the cover, wherein the electrical connector is configured to be electrically connected to the heat source.
 9. The cooling device according to claim 1, further comprising a liquid pump device connected to the tank.
 10. The cooling device according to claim 1, further comprising an air pump device connected to the tank. 